NXP Semiconductors

Sr. Wire Bond Equipment Engineer

Engineering

Employment

Full-time

From the employer

Full time

Level

Senior

Country assessment

Not doable from Austria because the employer's own board marks it as not remote.

Our assessment is guidance. Confirm arrangements with the employer.

Key Responsibilities

Maintain and support wire bond equipment to ensure high uptime and reliability.
Troubleshoot equipment issues and implement effective corrective actions.
Perform preventive maintenance and drive continuous equipment improvements.
Support production operations and minimize equipment downtime.
Work with Process, Production, and Quality teams to improve yield and product quality.
Lead and drive equipment qualification, sustaining , upgrade and automation projects.
Analyze equipment performance data and implement productivity improvements.
Develop and maintain maintenance procedures, work instructions, and technical documentation.
Train and mentor technicians on equipment operation and troubleshooting.

Requirements

Bachelor's degree or above in Engineering related field (Mechanical, Electrical are preferred).
Minimum 3 years of semiconductor manufacturing experience.
Strong troubleshooting and root cause analysis skills.
Familiar with SPC, FMEA, 8D, and continuous improvement methodologies.
Good communication and teamwork skills.
Able to support a fast-paced manufacturing environment.

Preferred Qualifications

#LI-2370