NXP Semiconductors
Process and Equipment Tech
Employment
Full-timeFrom the employer
Full time
Level
Not statedCategory
EngineeringCountry assessment
Not doable from Austria because it is tied to an office and never says it can be done remotely.
Our assessment is guidance. Confirm arrangements with the employer.
Job description
Plating Process Technician
Carryout the following activities
Set up Plating Line as process specification Setting up recipes based on product requirement Set up and maintenance of plating baths and miscellaneous related equipment related to electroplating Responsible for chemical addition based on lab analysis Chemical Filtration & Leaching activity Anode Top Up for respective plating lines
Requirement:
1) Diploma in Engineering (Chemical, Mechanical) or related
2) Previous experience in electroplating in semiconductor assembly
Plating Equipment Technician
Carryout the following activities
Set up Plating Line Loader and Unloader Change Over of Loader and Unloader Carryout periodical maintenance for plating machine Maintenance of plating machine fittings Replacement of Plating Pumps and Rectifiers Serving Pumps and Blowers
Requirement:
1) Diploma in Engineering (Electric/ Electronic, Mechanical) or related
2) Previous experience in electroplating in semiconductor assembly
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